Featured products

Fine Pitch Bump Adapters

FEATURES

  • Adapt to fine pitch footprints including TSSOPs and QFP's with  pitches down to 0.4mm
  • Features raised connection pads up to 0.010 [0.25]
  • Available in tape and reel for high speed SMT assembly
  • Can be manufactured for RoHS compliance

FEATURES

  • Reduce HDI construction by adapting smaller pitch devices to larger footprints
  • Convert 0.4mm and 0.5mm pitch footprints to 1mm or 1.27mm pitch (Please contact factory for other pitch requirements)
  • Enable the use of standard line and trace spacing
  • Eliminate the need for laser-drilled micro vias motherboards

PQFP-to-PGA Socket

FEATURES

  • Convert surface-mount PQFP packages to an Amp interstitial PGA footprint.
  • Reduce costs by using less-expensive PQFP packages to replace PGA footprints in existing designs.
  • Pins are mechanically fastened and soldered to board using Aries patented process, creating a reliable electrical connection and rugged contact.

PLCC-to-DIP Adapter

FEATURES

  • Converts PLCC packaged ICs to DIP footprints.
  • Ideal for prototyping and testing/evaluation.
  • Available with PLCC sockets or PLCC pads on top side.