High Power burn-in has its challenges. Unfortunately, devices made from the same wafer can have significantly different power dissipations that can adversely affect burn-in yields. By adding an interactive heatsink/heater with a RTD to the compression burn-in socket that interfaces with the burn-in board a uniform burn-in temperature is maintained. TechConnect works with the major burn-in socket vendors to provide a lower cost individual thermal control solution compatible with the Micro Control HPB5, HPB4, HPB-2, HPB-4, HPB3, HPB-5A, HPB-5B, LC-2 systems. We also supply solutions for non-MCC chambers.
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